Die Bonding at die-bonding.net

With its latest Multi-Chip Die Bonder, the 2200 apm+, Datacon meets the newest challenges of many users. The industry proven platform concept and the superior flexibility of the 2200 apm are now available on the 2200 apm+, with the added capability of handling wafers up to 300 mm and die up to 50 mm.

In just one module, the 2200 apm+ can flip the die, dip it in the dipping unit, and accurately place the component . Flip Chip and die attach or any combination of these are also possible, as placing various chips on a substrate on top of or next to each other all in one module!

Despite the wide range of fittings and set-up options, operation of the 2200 apm is easy to learn. Data transfer via the TCP/IP network is naturally implemented and the user interface is menu-driven.