Flip Chip Die Attach at flip-chip-die-attach.com

Datacon Flip Chip Die Attach is pioneer from the very beginning offers you the ideal system for series production in this highly sophisticated technology. The steps flip the component by 180 ?, cover it in the dipping unit, position the component can be processed in just one module.

It is the aim of Datacon to be able to offer not just the technology but also specific solutions for its customers. A professional, three-person team of trainers instructs the customers in both German and English. Datacon aims to be your essential technology partner for semiconductor production equipment.